The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2014
Filed:
May. 11, 2011
Yong Ha Jung, Incheon, KR;
Dae Jin Kim, Cheonan-si, KR;
Yong Ha Jung, Incheon, KR;
Dae Jin Kim, Cheonan-si, KR;
Hana Micron Inc., Chungcheongnam-do, KR;
Abstract
Provided is a stacked semiconductor package. The stacked semiconductor package of the present invention comprises: a substrate including at least one contact pad; an external chip laminate which includes a plurality of semiconductor chips mounted on the substrate, and which is stacked in multi-steps such that the ends at one side of the plurality of semiconductor chips alternately protrude in opposite directions to expose bonding pads which are formed on the up-face surface; at least one internal chip which is disposed in a mounting space formed between the external chip laminate and substrate so as to be electrically connected to the substrate; and a conductive wire electrically connecting the bonding pad of the semiconductor chip and the contact pad of the substrate.