The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2014
Filed:
Sep. 16, 2011
Applicants:
Kwang Soo Kim, Gyunggi-do, KR;
Ji Hyun Park, Seoul, KR;
Young Ki Lee, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Inventors:
Kwang Soo Kim, Gyunggi-do, KR;
Ji Hyun Park, Seoul, KR;
Young Ki Lee, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd, Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.