The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2014
Filed:
May. 08, 2008
Johan H. Klootwijk, AG Eindhoven, NL;
Freddy Roozeboom, AG Eindhoven, NL;
Jaap Ruigrok, AG Eindhoven, NL;
Derk Reefman, AG Eindhoven, NL;
Johan H. Klootwijk, AG Eindhoven, NL;
Freddy Roozeboom, AG Eindhoven, NL;
Jaap Ruigrok, AG Eindhoven, NL;
Derk Reefman, AG Eindhoven, NL;
IPDIA, Caen, FR;
Abstract
An integration substrate for a system in package comprises a through-substrate via and a trench capacitor wherein with a trench filling that includes at least four electrically conductive capacitor-electrode layers in an alternating arrangement with dielectric layers. —The capacitor-electrode layers are alternatingly connected to a respective one of two capacitor terminals provided on the first or second substrate side. The trench capacitor and the through-substrate via are formed in respective trench openings and via openings in the semiconductor substrate, which have an equal lateral extension exceeding 10 micrometer. This structure allows, among other advantages, a particularly cost-effective fabrication of the integration substrate because the via openings and the trench openings in the substrate can be fabricated simultaneously.