The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Jan. 27, 2010
Applicants:

Takeshi Sakamoto, Hamamatsu, JP;

Aiko Nakagawa, Hamamatsu, JP;

Inventors:

Takeshi Sakamoto, Hamamatsu, JP;

Aiko Nakagawa, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/20 (2006.01); H01L 21/36 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Fractures () are generated from modified regions () to front and rear faces () of a object to be processed (), respectively, while an unmodified region () is interposed between the modified regions (). This can prevent fractures from continuously advancing in the thickness direction of a silicon substrate () when forming a plurality of rows of modified regions (). By generating a stress in the object (), the fractures () are connected to each other in the unmodified region (), so as to cut the object (). This can prevent fractures from meandering in the rear face () of the object () and so forth, whereby the object () can be cut accurately along a line to cut the object ().


Find Patent Forward Citations

Sakamoto, Takeshi. (2014). Workpiece cutting method (U.S. Patent No. 8728914). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8728914

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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