The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Sep. 17, 2010
Applicants:

Shuichi Kitagawa, Tokyo, JP;

Kengo Mitose, Tokyo, JP;

Yoshiaki Kobayashi, Tokyo, JP;

Inventors:

Shuichi Kitagawa, Tokyo, JP;

Kengo Mitose, Tokyo, JP;

Yoshiaki Kobayashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/50 (2006.01); C25D 3/12 (2006.01); C25D 3/30 (2006.01); H01R 13/03 (2006.01); B23K 26/00 (2014.01); C22F 1/08 (2006.01);
U.S. Cl.
CPC ...
C25D 3/30 (2013.01); C25D 3/12 (2013.01); C25D 5/505 (2013.01); H01R 13/03 (2013.01); B23K 26/0081 (2013.01); C22F 1/08 (2013.01); Y10S 428/929 (2013.01);
Abstract

A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.


Find Patent Forward Citations

Loading…