The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Sep. 14, 2010
Applicants:

Daisuke Ryuzaki, Kokubunji, JP;

Takenori Narita, Hitachi, JP;

Yousuke Hoshi, Tsukuba, JP;

Tomohiro Iwano, Hitachi, JP;

Inventors:

Daisuke Ryuzaki, Kokubunji, JP;

Takenori Narita, Hitachi, JP;

Yousuke Hoshi, Tsukuba, JP;

Tomohiro Iwano, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); H01L 21/00 (2006.01); C09K 3/14 (2006.01); C09G 1/02 (2006.01); B24B 1/00 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1463 (2013.01); C09G 1/02 (2013.01); B24B 1/00 (2013.01); H01L 21/31053 (2013.01);
Abstract

A polishing agent of the invention comprises tetravalent metal hydroxide particles, a cationized polyvinyl alcohol, at least one type of saccharide selected from the group consisting of an amino sugar, a derivative of the amino sugar, a polysaccharide containing an amino sugar and a derivative of the polysaccharide, and water. The method for polishing a substrate of the invention comprises a step of polishing the silicon oxide film(film to be polished), formed on the silicon substratehaving the silicon oxide film, by relatively moving the silicon substrateand a polishing platen, in a state that the silicon oxide filmis pressed against a polishing pad on the polishing platen, while supplying the polishing agent of the invention between the silicon oxide filmand the polishing pad.


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