The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2014
Filed:
Jun. 18, 2012
Tetsuo Makida, Hiroshima, JP;
Kenji Nishimoto, Hiroshima, JP;
Osamu Sumida, Hiroshima, JP;
Tomonori Hashimoto, Hiroshima, JP;
Tetsuo Makida, Hiroshima, JP;
Kenji Nishimoto, Hiroshima, JP;
Osamu Sumida, Hiroshima, JP;
Tomonori Hashimoto, Hiroshima, JP;
The Japan Steel Works, Ltd., Tokyo, JP;
Abstract
In order to ensure quality of pellets by eliminating temperature differences among extrusion nozzle holes with use of a heating medium flowing through heating channels only once and flowing out through a heating medium outlet, provided is a die plate for resin granulation, in which a plate main body () is divided into regions (A to n) for every 360/n (n=4, 6, or 8) degrees, or into first to fourth regions (A to D) for every 90 degrees, and an inner annular heating passage () and an outer annular heating passage () are formed. A heating medium (F) supplied through a heating medium inlet () flows through heating channels () only once, and then flows out through a heating medium outlet () to an outside.