The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Jun. 21, 2012
Applicants:

Satoshi Mizukami, Kanagawa, JP;

Yoshikazu Akiyama, Kanagawa, JP;

Masaru Shinkai, Kanagawa, JP;

Keiji Ueda, Kanagawa, JP;

Kanshi Abe, Kanagawa, JP;

Takakazu Kihira, Kanagawa, JP;

Naoya Kondo, Kanagawa, JP;

Inventors:

Satoshi Mizukami, Kanagawa, JP;

Yoshikazu Akiyama, Kanagawa, JP;

Masaru Shinkai, Kanagawa, JP;

Keiji Ueda, Kanagawa, JP;

Kanshi Abe, Kanagawa, JP;

Takakazu Kihira, Kanagawa, JP;

Naoya Kondo, Kanagawa, JP;

Assignee:

Ricoh Company, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is an electromechanical transducer element that includes an electromechanical transducer film formed of a complex oxide (PZT) including lead (Pb), zirconium (Zr), and titanium (Ti). The electromechanical transducer film is formed by laminating plural PZT thin films until a thickness of the formed electromechanical transducer film becomes a predetermined thickness. When an atomic weight ratio (Pb/(Zr+Ti)) of average Pb included in the formed electromechanical transducer film is denoted by Pb(avg) and an atomic weight ratio (Pb/(Zr+Ti)) of Pb in any one of laminate interfaces of the plural PZT thin films is denoted by Pb(interface), the Pb(avg) is greater than or equal to 100 atomic percentage (at %) and less than or equal to 110 atomic percentage (at %), and a fluctuation ratio ΔPb=Pb(avg)−Pb(interface) of Pb in the laminate interface is less than or equal to 20 percent.


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