The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Mar. 09, 2012
Applicants:

Hidekazu Takahashi, Tokyo, JP;

Masahiko Inoue, Tokyo, JP;

Hiroyuki Ochiai, Tokyo, JP;

Inventors:

Hidekazu Takahashi, Tokyo, JP;

Masahiko Inoue, Tokyo, JP;

Hiroyuki Ochiai, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16J 15/52 (2006.01); F16J 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor fabrication device welded bellows of an accordion structure is characterized in that a plurality of annular bellows plates having faces curving in a radial direction are connected alternatingly at the outside diameter side and inside diameter side, wherein the annular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate, a gas layer disposed between the two bellows plates, the treatment-side bellows plate being of lesser thickness, and the non-treatment-side bellows plate being of greater thickness. The bellows are highly resistant to damage caused by foreign matter; or, in the unlikely case that the treatment-side bellows plate becomes damaged, the damage can be compensated for by the non-treatment side bellows plate.


Find Patent Forward Citations

Loading…