The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2014

Filed:

Apr. 20, 2011
Applicants:

Shih-liang Teng, New Taipei, TW;

Wei-liang Lin, New Taipei, TW;

Po-cheng Teng, New Taipei, TW;

Kuo-chu Yeh, New Taipei, TW;

Inventors:

Shih-Liang Teng, New Taipei, TW;

Wei-Liang Lin, New Taipei, TW;

Po-Cheng Teng, New Taipei, TW;

Kuo-Chu Yeh, New Taipei, TW;

Assignee:

Acbel Polytech Inc., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention discloses a compact server power supply having high power density has a casing, a main printed circuit board, a sub-printed circuit board, a power supplying circuit, a power output terminal set and a fan. The power supplying circuit has a primary side circuit unit, a transformer and a secondary side circuit unit. Electric elements of the primary and secondary side circuit units and the transformer are soldered on the main printed circuit board except parts of the electric elements of the secondary side circuit unit are soldered on the sub-printed circuit board. The sub-printed circuit board is vertically mounted and soldered on the main printed circuit board, so the length of the main printed circuit board is shortened to implement the server power supply having a compact size and high power density.


Find Patent Forward Citations

Loading…