The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Feb. 03, 2012
Kenichi Kawasaki, Echizen, JP;
Shunsuke Takeuchi, Echizen, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Kenichi Kawasaki, Echizen, JP;
Shunsuke Takeuchi, Echizen, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.