The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2014

Filed:

Sep. 04, 2008
Applicants:

Kei Hirata, Tokyo, JP;

Takayasu Kanaya, Tokyo, JP;

Kosuke Tanaka, Tokyo, JP;

Shinji Hara, Tokyo, JP;

Inventors:

Kei Hirata, Tokyo, JP;

Takayasu Kanaya, Tokyo, JP;

Kosuke Tanaka, Tokyo, JP;

Shinji Hara, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/33 (2006.01); B82Y 10/00 (2011.01); B82Y 25/00 (2011.01); G11B 5/39 (2006.01);
U.S. Cl.
CPC ...
B82Y 10/00 (2013.01); B82Y 25/00 (2013.01); G11B 5/3909 (2013.01); G11B 5/3932 (2013.01); G11B 5/3912 (2013.01); G11B 2005/3996 (2013.01);
Abstract

A thin film magnetic head including a magnetoresistive element (MR) having higher reading performance. In manufacturing the thin film magnetic head, after forming an MR element, a pair of magnetic domain controlling layers are formed by stacking a buffer layer, a magnetic bias layer and a first cap layer in this order on both sides, in a track-width direction, of the MR element via an insulating layer, respectively. Then, a second cap layer is formed to cover the upper surface of the MR element and connect the pair of cap-layers. Then, a gap adjustment layer and a top shielding layer are formed to cover the pair of first cap layers and the second cap layer, completing a read head section.


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