The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2014

Filed:

Oct. 11, 2011
Applicants:

Srinivasan Kodaganallur Ganapathi, Palo Alto, CA (US);

Nicholas Ian Buchan, San Jose, CA (US);

Kurt Edward Petersen, Milpitas, CA (US);

Ravindra V. Shenoy, Dublin, CA (US);

Peng Cheng Lin, Cupertino, CA (US);

Ericson Cheng, Santa Clara, CA (US);

Inventors:

Srinivasan Kodaganallur Ganapathi, Palo Alto, CA (US);

Nicholas Ian Buchan, San Jose, CA (US);

Kurt Edward Petersen, Milpitas, CA (US);

Ravindra V. Shenoy, Dublin, CA (US);

Peng Cheng Lin, Cupertino, CA (US);

Ericson Cheng, Santa Clara, CA (US);

Assignee:

QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
Abstract

This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.


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