The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Mar. 14, 2013
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventor:
Eiichi Hosomi, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
According to one embodiment, a semiconductor device includes a package substrate, a semiconductor package, a first semiconductor chip and a first bonding wire. The package substrate has a first pad on a first principal surface. The semiconductor package is mounted on the first principal surface of the package substrate. The semiconductor package contains a semiconductor chip and has a second pad. The first semiconductor chip is mounted on the semiconductor package. The first bonding wire is connected between the first pad and the second.