The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2014

Filed:

Jul. 12, 2012
Applicants:

Thomas J. Mcintyre, Nokesville, VA (US);

Keith K. Sturcken, Nokesville, VA (US);

Christy A. Hagerty, Haymarket, VA (US);

Inventors:

Thomas J. McIntyre, Nokesville, VA (US);

Keith K. Sturcken, Nokesville, VA (US);

Christy A. Hagerty, Haymarket, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating an electronic device package having a column grid array is disclosed. A column grid array package includes a substrate, an integrated circuit located on a first side of the substrate, and a set of solder columns located on a second side of the substrate. The column grid array package also includes multiple two-tab electronic devices located on the second side of the substrate. The heights of the two-tab electronic devices are substantially identical to the heights of the solder columns.


Find Patent Forward Citations

McIntyre, Thomas. (2014). Method for fabricating solder columns for a column grid array package (U.S. Patent No. 8723323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8723323

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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