The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Jun. 08, 2006
Christy Woo, Cupertino, CA (US);
Jun “charlie” Zhai, San Jose, CA (US);
Paul Besser, Sunnyvale, CA (US);
Kok-yong Yiang, Sunnyvale, CA (US);
Richard C. Blish, Saratoga, CA (US);
Christine Hau-riege, Fremont, CA (US);
Christy Woo, Cupertino, CA (US);
Jun “Charlie” Zhai, San Jose, CA (US);
Paul Besser, Sunnyvale, CA (US);
Kok-Yong Yiang, Sunnyvale, CA (US);
Richard C. Blish, Saratoga, CA (US);
Christine Hau-Riege, Fremont, CA (US);
GLOBALFOUNDIES Inc., Grand Cayman, KY;
Abstract
The peeling stress between a Cu line and a capping layer thereon, after via patterning, is reduced by varying the shape of the via and positioning the via to increase the space between the via and the line edge, thereby increasing electromigration lifetime. Embodiments include varying the shape of the via, as by forming an oval or rectangular shape via, such that the ratio of the minor axis of the oval to the line with or the ratio of the width of the rectangle to the line width is less than about 0.7.