The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Jun. 29, 2012
Isamu Yoshida, Fujisawa, JP;
Michiaki Hiyoshi, Yokohama, JP;
Takehide Yokozuka, Yokohama, JP;
Akihiro Muramoto, Kai, JP;
Isamu Yoshida, Fujisawa, JP;
Michiaki Hiyoshi, Yokohama, JP;
Takehide Yokozuka, Yokohama, JP;
Akihiro Muramoto, Kai, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.