The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2014

Filed:

Mar. 04, 2008
Applicants:

Nobuaki Otsuki, Suita, JP;

Manabu Akiyama, Ranzanmachi, JP;

Shouji Minegishi, Ranzanmachi, JP;

Masao Arima, Ranzanmachi, JP;

Inventors:

Nobuaki Otsuki, Suita, JP;

Manabu Akiyama, Ranzanmachi, JP;

Shouji Minegishi, Ranzanmachi, JP;

Masao Arima, Ranzanmachi, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.


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