The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
May. 19, 2009
Didem Ernur, Kessel-Lo, BE;
Romano Hoofman, Geel, BE;
Didem Ernur, Kessel-Lo, BE;
Romano Hoofman, Geel, BE;
NXP B.V., Eindhoven, NL;
Abstract
The present invention discloses an integrated circuit (IC) comprising a bond pad (); a substrate stack carrying a first layer () comprising conductive regions (); and an interconnect layer () over the first layer () comprising a dielectric material portion () between the bond pad () and the substrate stack, said portion comprising a plurality of air-filled trenches () defining at least one pillar () of the dielectric material (), at least said air-filled trenches () being capped by a porous capping layer (). The interconnect layer (), which typically is one of the uppermost interconnect layers of the IC, has an improved resilience to pressure exerted on the bond pad (). The present invention further teaches a method for manufacturing such an IC.