The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Feb. 22, 2011
Applicants:
Jae-hak Lee, Daejeon, KR;
Chang-woo Lee, Daejeon, KR;
Joon-yub Song, Daejeon, KR;
Tae-ho Ha, Daejeon, KR;
Inventors:
Jae-Hak Lee, Daejeon, KR;
Chang-Woo Lee, Daejeon, KR;
Joon-Yub Song, Daejeon, KR;
Tae-Ho Ha, Daejeon, KR;
Assignee:
Korea Institute of Machinery & Materials, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to a semiconductor chip stack package and a manufacturing method thereof, and more particularly, to a semiconductor chip stack package and a manufacturing method thereof in which a plurality of chips can be rapidly arranged and bonded without a precise device or operation so as to improve productivity.