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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8722436 B1

PDFFull Text
Date of Patent:
May. 13, 2014

Filed:

Nov. 25, 2013

Method and apparatus for accurate die-to-wafer bonding

Applicant:

Tsmc Solid State Lighting Ltd., Hsinchu, TW;

Inventors:

Chyi Shyuan Chern, Taipei, TW;

Hsin-Hsien Wu, Hsinchu, TW;

Chih-Kuang Yu, Chiayi, TW;

Hung-Yi Kuo, Taipei, TW;

Assignee:

TSMC Solid State Lighting Ltd., HsinChu, TW;

Attorney:

Haynes and Boone, LLP

Primary Examiner:

Cheung Lee

Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.

Find Patent Forward Citations

Chern, Chyi. (2014). Method and apparatus for accurate die-to-wafer bonding (U.S. Patent No. 8722436). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8722436

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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