The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8721954 B1

PDF
Full Text
Expired
Date of Patent:
May. 13, 2014

Filed:

Mar. 13, 2013
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

Mark L. La Forest, Granger, IN (US);

Roger L. Klinedinst, North Liberty, IN (US);

David M. Wright, Springfield, MA (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

In some examples, a method for densifying a material via pitch comprises inserting the material to be densified into a mold, wherein the mold is part of an apparatus. The apparatus may include a ram configured to apply a ram pressure sufficient to force a pitch into the mold to densify the material, a gas source configured to apply a gas pressure sufficient to force the pitch into the mold to densify the material, and a vacuum source operable to create a vacuum pressure in the mold at least prior to application of either the ram pressure or the gas pressure. The method may further comprise densifying the material in the mold via pitch using a selectable one of the ram, the gas source, the ram and the vacuum source, or the gas source and the vacuum source.


Find Patent Forward Citations

La Forest, Mark. (2014). Techniques for pitch densification (U.S. Patent No. 8721954). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8721954

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