The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2014

Filed:

Apr. 05, 2012
Applicants:

Xiaoping Bian, Saratoga, CA (US);

Qing Dai, San Jose, CA (US);

Oleksandr Mosendz, San Jose, CA (US);

Franck Dreyfus Rose, San Jose, CA (US);

Run-han Wang, San Jose, CA (US);

Inventors:

Xiaoping Bian, Saratoga, CA (US);

Qing Dai, San Jose, CA (US);

Oleksandr Mosendz, San Jose, CA (US);

Franck Dreyfus Rose, San Jose, CA (US);

Run-Han Wang, San Jose, CA (US);

Assignee:

HGST Netherlands B.V., Amsterdam, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A vacuum planarization method substantially improves the surface roughness of a thermally-assisted recording (TAR) disk that has a recording layer (RL) formed of a substantially chemically-ordered FePt alloy or FePt-X alloy (or CoPt alloy or CoPt-X alloy) and a segregant, like SiO. A first amorphous carbon overcoat (OC) is deposited on the RL and etched with a non-chemically reactive plasma to remove at least one-half the thickness of OC. Then a second amorphous carbon overcoat (OC) is deposited on the etched OC. The OCis then reactive-ion-etched, for example in a H/Ar plasma, to remove at least one-half the thickness of OC. A thin third overcoat (OC) may be deposited on the etched OC


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