The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Aug. 02, 2011
Motohaya Ishii, Atsugi, JP;
Takashi Yamada, Atsugi, JP;
Yoshiyuki Doi, Atsugi, JP;
Takashi Saida, Atsugi, JP;
Ken Tsuzuki, Atsugi, JP;
Takashi Goh, Atsugi, JP;
Hiroshi Yamazaki, Atsugi, JP;
Shinji Mino, Atsugi, JP;
Takao Fukumitsu, Atsugi, JP;
Atsushi Murasawa, Yokohama, JP;
Fumihiro Ebisawa, Yokohama, JP;
Hiroshi Terui, Yokohama, JP;
Tomoyo Shibazaki, Yokohama, JP;
Yuichi Kikuchi, Yokohama, JP;
Motohaya Ishii, Atsugi, JP;
Takashi Yamada, Atsugi, JP;
Yoshiyuki Doi, Atsugi, JP;
Takashi Saida, Atsugi, JP;
Ken Tsuzuki, Atsugi, JP;
Takashi Goh, Atsugi, JP;
Hiroshi Yamazaki, Atsugi, JP;
Shinji Mino, Atsugi, JP;
Takao Fukumitsu, Atsugi, JP;
Atsushi Murasawa, Yokohama, JP;
Fumihiro Ebisawa, Yokohama, JP;
Hiroshi Terui, Yokohama, JP;
Tomoyo Shibazaki, Yokohama, JP;
Yuichi Kikuchi, Yokohama, JP;
Nippon Telegraph and Telephone Corporation, Tokyo, JP;
NTT Electronics Corporation, Kanagawa, JP;
Abstract
In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component () comprises an optical device chip () including an LN waveguide (), a first PLC waveguide (), a second PLC waveguide (), and a fiber alignment member (), a mount (), and optical fibers (). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.