The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Dec. 24, 2009
Yun-kwon Park, Dongducheon-si, KR;
In-sang Song, Seoul, KR;
Seok-chul Yun, Yongin-sin, KR;
Seog-woo Hong, Yongin-si, KR;
Byeoung-ju Ha, Seongnam-si, KR;
Dong-ha Shim, Seoul, KR;
Hae-seok Park, Yongin-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Duck-hwan Kim, Goyang-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
In-sang Song, Seoul, KR;
Seok-chul Yun, Yongin-sin, KR;
Seog-woo Hong, Yongin-si, KR;
Byeoung-ju Ha, Seongnam-si, KR;
Dong-ha Shim, Seoul, KR;
Hae-seok Park, Yongin-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Duck-hwan Kim, Goyang-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A method for fabricating subminiature, high-performance monolithic duplexer is disclosed. The method comprises depositing and patterning a lower electrode on an upper surface of an insulation layer on a substrate, so as to expose a first part of the insulation layer; depositing a piezoelectric layer on an upper surface of the exposed insulation layer and the lower electrode; depositing a metal on the upper part of the piezoelectric layer and patterning the metal to form a resonance part and a trimming inductor, wherein the lower electrode electrically couples the resonance part and the trimming inductor; fabricating air gap type FBARs (film bulk acoustic resonances) by forming a cavity by etching the substrate under the resonance part; and bonding a packaging substrate on the substrate, the packaging substrate having a phase shifting part which substantially prevents inflow of signal between the air gap type FBARs.