The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Jul. 30, 2010
Applicants:
Shixi Louis Liu, Milpitas, CA (US);
Wenlong MA, Fremont, CA (US);
Frank Hin-fai Chau, Fremont, CA (US);
Barry Jia-fu Lin, Cupertino, CA (US);
Inventors:
Shixi Louis Liu, Milpitas, CA (US);
Wenlong Ma, Fremont, CA (US);
Frank Hin-Fai Chau, Fremont, CA (US);
Barry Jia-Fu Lin, Cupertino, CA (US);
Assignee:
TriQuint Semiconductor, Inc., Hillsboro, OR (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H01L 23/12 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments include but are not limited to apparatuses and systems including a die or a preform including at least one groove configured to extend from at least one via of the die to an edge of the die. Other embodiments may be described and claimed.
Liu, Shixi. (2014). Die including a groove extending from a via to an edge of the die (U.S. Patent No. 8718720). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8718720
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile