The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Dec. 15, 2011
Fumiaki Arimai, Chiyoda-ku, JP;
Hiroyoshi Nishizaki, Chiyoda-ku, JP;
Shozo Kanzaki, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A resin-sealed electronic controller obtained by bonding and fixing a circuit board to a thermally-conductive base plate, and integrating circuit components with a molding resin so as to reduce the size. A base plate includes a first exposed portion, a second exposed portion, and an adjacent flat portion adjacent to a central window hole. First circuit components which are low-heat-generating components with large height are located in the central window hole. Second circuit components which are high-heat-generating components with small height are provided on an area corresponding to the adjacent flat portion. A height dimension of the first circuit components at least partially overlaps a thickness dimension of the base plate, to reduce a total thickness dimension. The high-heat-generating components and the low-heat-generating components being provided separately from each other permits increased mounting density of low-heat-generating components, reducing an area of the circuit board.