The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2014

Filed:

Nov. 26, 2009
Applicants:

Makoto Hattori, Aichi, JP;

Kazuki Niwa, Aichi, JP;

Takashi Nakagami, Aichi, JP;

Koji Nakano, Aichi, JP;

Shunsuke Yakushiji, Aichi, JP;

Inventors:

Makoto Hattori, Aichi, JP;

Kazuki Niwa, Aichi, JP;

Takashi Nakagami, Aichi, JP;

Koji Nakano, Aichi, JP;

Shunsuke Yakushiji, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/00 (2013.01); H05K 1/0201 (2013.01); H05K 5/0247 (2013.01);
Abstract

An integrated-inverter electric compressor and an inverter unit thereof are provided, with which sufficient anti-vibration properties can be ensured and weight reduction can be achieved. In an integrated-inverter electric compressor, an inverter unit includes an inverter module in which a power-system metallic board having mounted thereon semiconductor switching elements and so forth is integrated with a plastic case, and a CPU board having mounted thereon a control and communication circuit that operates at a low voltage, such as a CPU, is provided on a top face of the inverter module, and inside the plastic case, a thermosetting resin layer for insulation and anti-humidity purposes is provided so as to cover a top face of the power-system metallic board, and a vibration-absorbing elastomeric adhesive layer that maintains a rubber state in an operating temperature range of the integrated-inverter electric compressor is provided between a bottom face of the CPU board and the thermosetting resin layer.


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