The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8717057 B1

PDF
Full Text
Expired
Date of Patent:
May. 06, 2014

Filed:

Aug. 15, 2008
Applicants:

Kenneth Kaskoun, San Diego, CA (US);

Sanjay K. Jha, San Diego, CA (US);

Inventors:

Kenneth Kaskoun, San Diego, CA (US);

Sanjay K. Jha, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Digeo, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

By constructing a universal test circuit on a tester chip, and stacking the tester chip in an IC package together with operational circuit chips to be tested, the problems inherent with external IC testing are reduced. The tester chip can be standardized across a number of different chip combinations and, if desired, pre-programmed during manufacturing for a particular package. The tester chip interfaces to other chips in the stack advantageously are standardized.


Find Patent Forward Citations

Kaskoun, Kenneth. (2014). Integrated tester chip using die packaging technologies (U.S. Patent No. 8717057). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8717057

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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