The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Nov. 30, 2012
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventors:
Ki Young Kim, Seongnam-si, KR;
Myung Gun Park, Seoul, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multi-chip package includes a main substrate; a plurality of first semiconductor chips stacked on an upper surface of the main substrate and having bonding pads which are electrically connected with the main substrate; and a semiconductor package attached to side surfaces of the stacked first semiconductor chips and electrically connected with the main substrate.