The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Nov. 10, 2011
Jinzhong Yao, Tianjin, CN;
Wai Yew Lo, Petaling Jaya, MY;
Lan Chu Tan, Shah Alam, MY;
Xuesong Xu, Tianjin, CN;
Jinzhong Yao, Tianjin, CN;
Wai Yew Lo, Petaling Jaya, MY;
Lan Chu Tan, Shah Alam, MY;
Xuesong Xu, Tianjin, CN;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.