The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
May. 14, 2008
Andrew T. Daly, Sinking Spring, PA (US);
Sabine Molitor-limberg, Eslohe, DE;
Andrew T. Daly, Sinking Spring, PA (US);
Sabine Molitor-Limberg, Eslohe, DE;
Akzo Nobel Coatings International B.V., Arnhem, NL;
Abstract
The present invention provides coating powders that enable improved filiform corrosion resistance in clear or tinted clear coating comprising an epoxy functional acrylic copolymer component having a Tof from 40° C. to 90° C. and chosen from a copolymer or copolymer mixture that comprises, based on the total weight of copolymerized monomers in the epoxy functional acrylic copolymer component, i) from 10 to 40 wt. % of one or more epoxy functional unsaturated monomer, e.g. glycidyl (meth)acrylate; ii) from 2.0 wt. % to 13 wt. %, preferably 12 wt. % or less, or, more preferably, 6 wt. % or less, of one or more hydrophobic acrylic monomer that has a mass solubility in water of 3.5 g/L or less and which would itself form a homopolymer having a glass transition temperature (T) of 50° C. to 175° C., e.g. a bicycloalkyl(meth)acrylate, and iii) the remainder of one or more nonionic comonomer that is not a hydrophobic acrylic monomer ii), e.g. methyl methacrylate; one or more crosslinker for the thermosetting acrylic copolymer; and, optionally, one or more adhesion promoter, e.g. epoxy resin, a light stabilizer, an ultraviolet (UV) absorber, and/or a hydrophobic submicron particle.