The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Mar. 09, 2007
Makoto Dobashi, Saitama, JP;
Mitsuyoshi Matsuda, Saitama, JP;
Sakiko Tomonaga, Saitama, JP;
Hisao Sakai, Saitama, JP;
Tomohiro Sakata, Saitama, JP;
Junshi Yoshioka, Saitama, JP;
JO Nishikawa, Saitama, JP;
Takeo Taguchi, Saitama, JP;
Makoto Dobashi, Saitama, JP;
Mitsuyoshi Matsuda, Saitama, JP;
Sakiko Tomonaga, Saitama, JP;
Hisao Sakai, Saitama, JP;
Tomohiro Sakata, Saitama, JP;
Junshi Yoshioka, Saitama, JP;
Jo Nishikawa, Saitama, JP;
Takeo Taguchi, Saitama, JP;
Mitsui Mining & Smelting Co., Ltd, Tokyo, JP;
Abstract
It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.