The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Jul. 23, 2010
Chen-ke Hsu, Hsinchu, TW;
Liang-sheng Chi, Hsinchu, TW;
Chun-chang Chen, Hsinchu, TW;
Win-jim Su, Hsinchu, TW;
Hsu-cheng Lin, Hsinchu, TW;
Mei-ling Tsai, Hsinchu, TW;
Yi Lung Liu, Hsinchu, TW;
Chen Ou, Hsinchu, TW;
Chen-Ke Hsu, Hsinchu, TW;
Liang-Sheng Chi, Hsinchu, TW;
Chun-Chang Chen, Hsinchu, TW;
Win-Jim Su, Hsinchu, TW;
Hsu-Cheng Lin, Hsinchu, TW;
Mei-Ling Tsai, Hsinchu, TW;
Yi Lung Liu, Hsinchu, TW;
Chen Ou, Hsinchu, TW;
Epistar Corporation, Hsinchu, TW;
Abstract
A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.