The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Sep. 14, 2012
Applicants:

Hong Tian, Seattle, WA (US);

Mackenzie Smith, Issaquah, WA (US);

Devesh Mishra, Issaquah, WA (US);

Inventors:

Hong Tian, Seattle, WA (US);

Mackenzie Smith, Issaquah, WA (US);

Devesh Mishra, Issaquah, WA (US);

Assignee:

Amazon Technologies, Inc., Reno, NV (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Various systems, methods, and programs embodied in computer-readable mediums are provided for determining optimum sizes of packaging in a packaging suite employed in a materials handling facility. The packaging may be used, for example, in the shipping of items from the materials handling facility to various destinations. The sizes of the packaging in the packaging suite are determined based upon the shipping volumes associated with packages or shipments shipped from the materials handling facility.


Find Patent Forward Citations

Loading…