The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Apr. 11, 2012
Applicants:

Satoru Hiramoto, Nagoya, JP;

Yoshiyuki Kono, Obu, JP;

Akitoshi Mizutani, Okazaki, JP;

Takamitsu Kubota, Chiryu, JP;

Atsushi Tanaka, Anjo, JP;

Takehito Mizunuma, Chiryu, JP;

Inventors:

Satoru Hiramoto, Nagoya, JP;

Yoshiyuki Kono, Obu, JP;

Akitoshi Mizutani, Okazaki, JP;

Takamitsu Kubota, Chiryu, JP;

Atsushi Tanaka, Anjo, JP;

Takehito Mizunuma, Chiryu, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 7/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A rotation angle sensor includes a housing, a detected object, a magnetism generation section, a housing cover, a circuit substrate, a sensing IC, and a resin body. The sensing IC includes a magnetism detection element, a molded body, and leads. The magnetism detection element outputs a signal in accordance with a change in a magnetic field due to a rotation of the detected object. The molded body covers the magnetism detection element. One end portion of each lead is electrically coupled with the magnetism detection element and the other end portion of each lead protrudes from the molded body and is electrically coupled with the circuit substrate. The resin body seals a portion of the molded body located between the magnetism detection element and the housing cover, the leads, and the circuit substrate.


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