The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Sep. 23, 2011
Jeong-woo Park, Suwon-si, KR;
Moon-gi Cho, Suwon-si, KR;
Ui-hyoung Lee, Seoul, KR;
Sun-hee Park, Seoul, KR;
Jeong-woo Park, Suwon-si, KR;
Moon-gi Cho, Suwon-si, KR;
Ui-hyoung Lee, Seoul, KR;
Sun-hee Park, Seoul, KR;
Abstract
Semiconductor packages connecting a semiconductor chip to an external device by bumps are provided. The semiconductor packages may include a connection pad on a semiconductor chip, a connecting bump on and configured to be electrically connected to the connection pad and a supporting bump on the semiconductor chip and configured to be electrically isolated from the connection pad. The connection bump may include a first pillar and a first solder ball and the supporting bump may include a second pillar and a second solder ball. The semiconductor packages may further include a solder channel in the second pillar configured to allow a portion of the second solder ball to extend into the solder channel along a predetermined direction.