The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

May. 22, 2012
Applicants:

Satoshi Tsukiyama, Yokohama, JP;

Masatoshi Fukuda, Yokohama, JP;

Hiroshi Watabe, Hino, JP;

Keita Mizoguchi, Yokohama, JP;

Naoyuki Komuta, Oita, JP;

Inventors:

Satoshi Tsukiyama, Yokohama, JP;

Masatoshi Fukuda, Yokohama, JP;

Hiroshi Watabe, Hino, JP;

Keita Mizoguchi, Yokohama, JP;

Naoyuki Komuta, Oita, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.


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Tsukiyama, Satoshi. (2014). Semiconductor device and manufacturing method thereof (U.S. Patent No. 8710654). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8710654

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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