The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Mar. 20, 2012
Applicant:
Masanori Takahashi, Yokohama, JP;
Inventor:
Masanori Takahashi, Yokohama, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a first wiring board, a first semiconductor element mounted on the first wiring board, a second wiring board disposed over the first semiconductor element, and a second semiconductor element mounted on the second wiring board. The wiring boards are electrically interconnected by a connecting portion interposed therebetween. A resin layer is formed between the wiring boards such that the first semiconductor element mounted on the first wiring board is sealed and such that the wiring boards having the respective semiconductor elements mounted thereon are bonded together.