The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Nov. 18, 2010
Romi Mayder, San Jose, CA (US);
Mark A. Alexander, San Francisco, CA (US);
Howard Johnson, Twisp, WA (US);
Romi Mayder, San Jose, CA (US);
Mark A. Alexander, San Francisco, CA (US);
Howard Johnson, Twisp, WA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
Integrated circuits are fabricated with mounted discrete capacitors. Bond pads and land pads are fabricated on a semiconductor wafer. Discrete capacitors are mounted on the semiconductor wafer with flexible adhesive. The flexible adhesive accommodates a difference in thermal expansion between the discrete capacitors and the semiconductor wafer. The land pads are electrically coupled to the electrodes of the discrete capacitors. The semiconductor wafer is separated into multiple semiconductor dice. The semiconductor dice are mounted in respective packages. The bond pads on each semiconductor die are electrically coupled to the interconnect terminals of the respective package.