The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Feb. 27, 2013
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Kiyoe Shigetomi, Ibaraki, JP;

Masayuki Okamoto, Ibaraki, JP;

Masato Yamagata, Ibaraki, JP;

Jun Akiyama, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/22 (2006.01); B32B 15/04 (2006.01); B32B 7/12 (2006.01); C08L 39/00 (2006.01); C08J 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An acrylic pressure-sensitive adhesive composition contains 100 parts by mass of an acrylic polymer (A), 1 to 70 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight (Mw) of 1000≦Mw<30000, and 1 to 50 parts by mass of a hydrogenated tackifying resin (C). The (meth)acrylic polymer (B) is a polymer having a weight average molecular weight smaller than that of the acrylic polymer (A) as a pressure-sensitive adhesive composition, and functions as a tackifying resin along with the hydrogenated tackifying resin (C).


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