The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Dec. 20, 2010
Beibei Song, Zhaoqing, CN;
Yongsheng Song, Zhaoqing, CN;
Fangce MO, Zhaoqing, CN;
Juan LI, Zhaoqing, CN;
Xiaoguo Wang, Zhaoqing, CN;
Jinghua Guo, Zhaoqing, CN;
Beibei Song, Zhaoqing, CN;
Yongsheng Song, Zhaoqing, CN;
Fangce Mo, Zhaoqing, CN;
Juan Li, Zhaoqing, CN;
Xiaoguo Wang, Zhaoqing, CN;
Jinghua Guo, Zhaoqing, CN;
Guangdong Fenghua Advanced Technology Holding Co., Ltd., Zhaoqing, Guangdong Province, CN;
Abstract
Provided is an anti-reductive high-frequency ceramic dielectric material sintered at low temperature and matched with copper internal electrode, which can be used for producing multi-layer ceramic capacitor with a copper internal electrode. The ceramic dielectric material consists of main crystalline phase, modifying additive and sintering flux. The formula of the main crystalline phase is MgBaZrSiO, wherein 0.8≦x≦0.95, 0.05≦y≦0.2. The modifying additive is one or more of MnO, CaO, LiO, BiOand TiO, and the sintering flux is one or more of BO, SiO, ZnO, CuO, KO and BaO. The ceramic dielectric material meets the requirements of COG characteristics by EIA standard, has such characteristics as uniform particle size distribution, high dispersiveness, optimized molding process, eco-friendliness and excellent dielectric properties.