The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
May. 25, 2012
Stephen W. Bedell, Wappingers Falls, NY (US);
Keith E. Fogel, Hopewell Junction, NY (US);
Paul A. Lauro, Brewster, NY (US);
Ning LI, White Plains, NY (US);
Devendra K. Sadana, Pleasantville, NY (US);
Ibrahim Alhomoudi, Alhufof, SA;
Stephen W. Bedell, Wappingers Falls, NY (US);
Keith E. Fogel, Hopewell Junction, NY (US);
Paul A. Lauro, Brewster, NY (US);
Ning Li, White Plains, NY (US);
Devendra K. Sadana, Pleasantville, NY (US);
Ibrahim Alhomoudi, Alhufof, SA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for spalling local areas of a base substrate utilizing at least one stressor layer portion which is located on a portion, but not all, of an uppermost surface of a base substrate. The method includes providing a base substrate having a uniform thickness and a planar uppermost surface spanning across an entirety of the base substrate. At least one stressor layer portion having a shape is formed on at least a portion, but not all, of the uppermost surface of the base substrate. Spalling is performed which removes a material layer portion from the base substrate and provides a remaining base substrate portion. The material layer portion has the shape of the at least one stressor layer portion, while the remaining base substrate portion has at least one opening located therein which correlates to the shape of the at least one stressor layer.