The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Apr. 15, 2009
Yuichi Urano, Matsumoto, JP;
Kenichi Kazama, Matsumoto, JP;
Yuichi Urano, Matsumoto, JP;
Kenichi Kazama, Matsumoto, JP;
Fuji Electric Co., Ltd., Kawasaki-Shi, JP;
Abstract
Even when a substrate for treatment is joined with a supporting substrate having an outer shape larger than that of the substrate for treatment, with a photothermal conversion layer and an adhesive layer interposed, and the surface of the substrate for treatment on the side opposite this joined surface is treated, the occurrence of a defective external appearance on the treatment surface of the substrate for treatment is prevented. An adhesive layeris formed on one surface of a substrate for treatment, a photothermal conversion layeris formed on one surface of a supporting substratehaving a surface with an outer shape larger than that of the surface of the substrate for treatment, and the substrate for treatmentis bonded onto the surface of the photothermal conversion layerwith the adhesive layerinterposed, to obtain a layered member. This layered member is placed on a spin chuckin a chamberof a spin coater device, an alkaline aqueous solutionis dropped onto a portionof the photothermal conversion layerwhich protrudes from the substrate for treatment, and thereafter cleaning is performed on this portion using a high-pressure cleaning nozzle. Then, grinding, wet treatment, or similar treatment is performed on the surface of the substrate for treatment, to manufacture a semiconductor device.