logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8709587 B1

PDFFull Text
Expired
Date of Patent:
Apr. 29, 2014

Filed:

Dec. 22, 2009

Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device

Applicant:

Kuniharu Umeno, Tokyo, JP;

Inventor:

Kuniharu Umeno, Tokyo, JP;

Assignee:

Sumitomo Bakelite Company, Ltd., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/38 (2006.01); B32B 38/08 (2006.01); C08G 59/22 (2006.01); C08G 59/32 (2006.01); C08G 59/68 (2006.01); C09J 163/00 (2006.01); C09D 163/00 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Find Patent Forward Citations

Umeno, Kuniharu. (2014). Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device (U.S. Patent No. 8709587). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8709587

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…