The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Dec. 22, 2009
Applicant:
Kuniharu Umeno, Tokyo, JP;
Inventor:
Kuniharu Umeno, Tokyo, JP;
Assignee:
Sumitomo Bakelite Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/38 (2006.01); B32B 38/08 (2006.01); C08G 59/22 (2006.01); C08G 59/32 (2006.01); C08G 59/68 (2006.01); C09J 163/00 (2006.01); C09D 163/00 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.