The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Jul. 21, 2005
Michael J. Stevenson, Sedona, AZ (US);
Robert A. Reeves, Cottonwood, AZ (US);
Michael J. Stevenson, Sedona, AZ (US);
Robert A. Reeves, Cottonwood, AZ (US);
Other;
Abstract
The molding method of the invention is a low-temperature, liquid-phase, injection molding process using an externally heated mold. This molding process is ideally suited for production of limited quantities of molded parts, as comparatively low cost molds can be used. The molding composition used in the invention is a mixture of a carrier and binder component and a powdered polyethylene component. The carrier and binder component can be a very low density polyethylene, petroleum jelly, hydrocarbon waxes, liquid hydrocarbon oils, or mixtures thereof. The powdered polyethylene component is finely subdivided polyethylene, preferably ultra high molecular weight, having a low melt index, at least no greater than 30. The carrier and binder component is used in sufficient quantity to provide a thixotropic mixture with a consistency of toothpaste, typically having a stirred viscosity up to 30,000 centipoise at the injection temperature of the molding process. Since the process utilizes a mold which is externally heated, it can be controlled to provide minimal heating of the core of the part, thereby permitting one to incorporate components within the part without damage to temperature sensitive elements in the components.