Damping member, shock damping structure in electronic device, and electronic device using the shock damping structure

Abstract

A damping member includes a body provided between a device case and a module encased within the case and damping an external shock applied on the case. The body includes a holding member having upper and side surfaces and disposed between an inner peripheral surface of the case and an outer peripheral surface of the module, a first shock absorbing member covering a predetermined part of the upper and side surfaces of the holding member, deformed elastically when the shock is applied on the case, and elastically absorbing the shock, and a second shock absorbing member covering the other part of the holding member, getting the shock earlier than the first shock absorbing member when the shock is applied on the case, each changing its volume in accordance with the shock, and absorbing and escaping the shock. A damping structure used for an electronic device uses the damping member.