The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Jul. 20, 2012
Applicants:

Faming LI, Solon, OH (US);

Jing Zhou, Rochester, NY (US);

Fusheng Xu, Webster, NY (US);

Jack Gaynor Elliot, Penfield, NY (US);

Inventors:

Faming Li, Solon, OH (US);

Jing Zhou, Rochester, NY (US);

Fusheng Xu, Webster, NY (US);

Jack Gaynor Elliot, Penfield, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 29/393 (2006.01); B41J 25/308 (2006.01); B41J 11/00 (2006.01);
U.S. Cl.
CPC ...
B41J 29/393 (2013.01); B41J 25/308 (2013.01); B41J 11/0095 (2013.01);
Abstract

An indirect media flatness measurement system, and method, by which the appropriate level of hold-down force may be determined with some degree of quantitative accuracy. In an ink jet printer that is operative to subject a substrate media to a hold down force during printing, the method including printing a predetermined test image having a predetermined pattern on a substrate media using an ink jet print apparatus to produce a test print. Optionally, pattern may be an array of test symbols. The test symbol may include a line printed on the substrate media in a direction perpendicular to a process direction of the printer. The test print is compared with the predetermined test image, including measuring drop placement errors of test symbols. The height of the substrate media at the location of each test symbol is calculated based upon the drop placement error.


Find Patent Forward Citations

Loading…