The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2014

Filed:

Nov. 29, 2011
Applicants:

Michael Knauss, Pfullingen, DE;

Scott Naugle, Venetia, PA (US);

Andy Doller, Sharpsburg, PA (US);

Eric Ochs, Pittsburgh, PA (US);

Inventors:

Michael Knauss, Pfullingen, DE;

Scott Naugle, Venetia, PA (US);

Andy Doller, Sharpsburg, PA (US);

Eric Ochs, Pittsburgh, PA (US);

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/28 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 1/2807 (2013.01);
Abstract

A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.


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