The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Sep. 01, 2010
Michael Luppold, Dettenheim, DE;
Alexander Dauth, Maulbronn, DE;
Michael Luppold, Dettenheim, DE;
Alexander Dauth, Maulbronn, DE;
Borgwarner Beru Systems GmbH, Ludwigsburg, DE;
Abstract
Some invention embodiments relate to a method for forming a fuse which electrically connects two metal surfaces () that are arranged on a printed circuit board () next to each other and spaced apart from each other. It is provided according to the invention that the two metal surfaces () are each partially covered with a protective coating (), wherein a partial region forming a contact region () remains uncovered, liquid soft solder material () which bridges the gap between the two metal surfaces () is applied onto the two uncovered partial regions (), and the protective coating () in a surrounding area of the solder material () is removed after the soft solder material () has solidified, in order to form receiving regions () which are wetted by the solder material () when the latter fuses, with the result that the solder material () flows off from a printed circuit board region () between the two metal surfaces () and the electrical contact formed by the solder material () is interrupted. Furthermore, other invention embodiments relate to a printed circuit board with such a fuse.